Material:RO5200, RO5400, RO5252(Ta-2.5W), RO5255(Ta-10W)
Size: circular targets:Diameter 15mm up to 400mm x Thickness 3mm up to 28mm
rectangular targets:Thickness 1mm up to 40mm x Width up to 1000mm x Length up to 3000mm
Table 1: technology parameter
Grade | 3N, 3N5, 4N, with Ta 99.99%min |
Recrystallization | 95%min |
Grain size | ASTM 4 or finer |
Surface finish | 16Rms max. or Ra 0.4 ( RMS64 or better) |
Flatness | 0.1mm or 0.15% max |
Tolerance | +/-0.010" on all dimensions |
Table 1. Chemical composition:
Tantalum target
SPUTTERING TARGET BONDING Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded ...
Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded to a metallic or ceramic ...
Metal sputtering targets are critical components of the sputtering process used in the manufacturing of thin films for semiconductor and other advanced applications. These targets are high-purity metals or alloys with specific chemical compositions, and they are subjected to ...