Product Quick Detail

Minimum Order
1
Place Of Origin
China
Packaging
as the order
Delivery
15 Days

Layer:1~22 layers
Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg
Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating
Max.Panel Size: 550 * 650mm
Min. Finished Holes Size: 0.10mm
Microvias diameter: 0.10 - 0.15mm
Min. Line Width/Spacing: 0.075 / 0.075mm
Copper Feature to Holes(Outer): ±0.075mm
Min. Plated Drills to Copper (inner): 0.25mm
Min. Copper to Edge distance: 0.25mm
Max. Copper Thickness: 140μm
Max. Board Thickness: 4.80 mm
Min Board Thickness: 0.20mm
Min. Core Thickness: 0.10mm
Min. Soldermask Dam: 0.10mm
  • Country: China (Mainland)
  • Business Type:
  • Market:Americas,Asia,Europe,European Union,G20
  • Founded Year:1994
  • Address:Building 3, No. 3, West Area, Shangxue Technology City, Bantian, Longgang District
  • Contact:Tony Kuang
*Your name:
*Your Email:
*To:E-Tech (Shenzhen) Technology Co., Ltd.
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters : 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

submiting now We do inquire for you , please wait ...