Thermal Conductive compound for PCB/CPU/LED heat sink
Specifications
ROHS Compliant: Yes
UL recognized: Yes
Features and Benefits:
Thermal conductivity: 1~5.5 W/m·K
Excellent thermal performance
Good reliability
Superior ability to flow and conform to interfaces
Non-toxic, non-corrosive
Application: 1. Power supply
2.Between a CPU and a heat spreader
3. Used between a semiconductor and heat sink;
4. Areas where heat needs to be transferred
to the frame or other type of heat spreader
5. Thermoelectric cooling device
- Country: China (Mainland)
- Market: Europe,Americas,Oceania,Asia
- Founded Year: 2004
- Contact: Elena Liu
