Electroformed hub dicing blade Alisa@moresuperhard.com
Product Quick Detail
- FOB Price
- USD $20.00 / Piece
- Minimum Order
- 1
- Place Of Origin
- China
- Packaging
- carton box with foam box (Gift package is available)
- Delivery
- 15 Days
Specifications
Applications of hub dicing blade:
cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass
The features of hub type dicing blade:
* improving balance between blade life and processing quality (in particular backside chipping)
* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions
* precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges
* Realizes high speed wafer cutting after laser grooving.
If you have any questions, please contact us
Whats App:+8618638297665
Skype:18638297665
Alisa@moresuperhard.com
Tel:18638297665
URL:www.moresuperhard.com
- Country: China (Mainland)
- Business Type: 贸易公司
- Market:非洲,欧洲,美洲,中东
- Founded Year:2014
- Address:
- Contact:Alisa Zhang
