IC Substrate&Substrate-Like PCB CSP/FC-CSP/SIP/FC-BGA/WB-CSP FR4/BT/High-Speed Material Trace Width/Space 12/12μm SM Registration:±20μm Strict SM Flatness Control ≤5μm Founded in 2007,PEAK ...
HDI PCB Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm)≥0.075 High Density Interconnector Founded in 2007,PEAK ...
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...