HDI-High Density Interconnect

HDIhigh density interconnect

There are 6 different types ofHDI high density interconnect

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, RayMing uses laser-drilled microvias electroplated with copper.

Special technologies used with HDI any-layer printed circuit boards:

•Edge plating for shielding and ground connection

•Minimum track width and spacing in mass production around 40μm

•Stacked microvias (plated copper or filled with conductive paste)

•Cavities, countersunk holes or depth milling

•Solder resist in black, blue, green, etc.

•Low-halogen material in standard and high Tg range

•Low-DK Material for Mobile Devices

•All recognised printed circuit board industry surfaces available

HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. This includes touch screen computing, 4G network communications and military applications such as avionics and smart munitions.

HDI PCB China capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. This includes touch screen computing, 4G network communications and military applications such as avionics and smart munitions.

HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.