Metal Bond Micron Diamond

Our metal bondmicron diamond powder

For resin bond, vitrified bond, and electroplated bond.

Application: for stone, watch, optical glass etc.

EA-MW19

Irregular shape, low toughness, uniform Particle Size Distribution.

The best choice when cost is the main concern in the process.

For Lapping, Grinding the hard and fragile material

EA-MW30

Semi-blocky shape, medium toughness, uniform Particle Size Distribution

Good combination of high grinding performance and high finishing.

For Lapping, Grinding the hard and Brittle material

EA-MW40

Blocky shape, high toughness, uniform Particle Size Distribution, clean

more wear-resistant than EA-MW30.

For Lapping, Grinding and Fishing the hard and Brittleness material

EA-MW50

Very blocky shape, high toughness, Narrow Particle Size Distribution, very clean

Very long using life and very high finishing.

For Optical objects, magnet heard, HDD

Other sizes are also available according to customer requirement.

EGrind