HDI PCB Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm)≥0.075 High Density Interconnector Founded in 2007,PEAK ...
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
Number of layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2.5mil Inner layer W/S: 4.5/4.5mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 6 Layer ENIG Impedance Control PCB Bare Board Own lamination process to ...