FGNEX ultra-flexible and ultra-thin silicon wafers use advanced organic polymer packaging materials, with a minimum bending radius of 0.25m, a thickness of 1.4mm, and a weight of 4.3kg, which
are at the leading level in the photovoltaic industry.
In addition, MWT back contact batteries and modules adopt bus-free design, which is more efficient, so the shape and installation of BIPV applications are further integrated with the
building.
In order to protect the environment, we adopt environmentally-friendly photovoltaic design to achieve lead-free MWT modules without soldering materials.