Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer PCB Own lamination process to convenient production for Multilayer PCB ...
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...