What is FR4? FR4 is the name of a type of epoxy glazing material. fr stands for flame retardant. 4 refers to the factors that differentiate it from other materials. FR4 means two things. The material. As a construction material, it refers to epoxy laminates reinforced with ...
What is FR4? FR4 is the name of a type of epoxy glazing material. fr stands for flame retardant. 4 refers to the factors that differentiate it from other materials. FR4 means two things. The material. As a construction material, it refers to epoxy laminates reinforced with ...
Via In pcb board material fr4, using copper plating or epoxy to fill holesfor circuit board factor, prevent solder paste or flux from flowing into the via in pad, avoid solder ball getting into via or solder mask cover on pad and cause false soldering. HUIHE CIRCUITS Via In Pad ...
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...
Number of layers: 4 size:80*88mm Surface finish: ENIG Base material: Rogers FR4 4350B Min. hole diameter: 0.3mm Minimum Line Width:0.230mm Minimum Line Space:0.170mm Thickness: 1.0mm Advantages Of 4 Layer Rogers FR4 PCB Own lamination process to convenient production for ...
Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for ...
Number of layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias Advantages Of 14 Layer PCB Own lamination process to convenient production for ...
Number of layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias Advantages Of 10 Layer ENIG Blind Vias PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead ...
Buried vias PCB & blind vias PCB, use micro blind vias to increase the trace distribution density. Improve radio frequency, electromagnetic wave interference and hear conduction. Apply to computer server, mobile phone and digital camera products.HUIHE CIRCUITS is China HDI PCB ...
Number of layers: rogers fr4 size:80*88mm Surface finish: ENIG Base material: FR4+Rogers 4350B Min. hole diameter: 0.3mm Minimum Line Width:0.230mm Minimum Line Space:0.170mm Thickness: 1.0mm Advantages Of 4 Layer rogers fr4 pcb Own lamination process to convenient ...