Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...
Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient ...
Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 8.5/3.5mil Thickness: 0.8mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of Two Sided PCB Own lamination process to convenient production for Multilayer PCB and shorten the lead ...