Type: | 1A1R |
Bond: | Resin or Metal |
Application: | Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN(copper epoxy molding ), splitter, sapphire |
Specification: | Customized |
Brand Mark: | Moresuperhard |
Trade Terms: | FOB |
Packages: | Hard carton |
Delivery Time: | 15 workdays by express |
Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, is used for cutting and slotting of electronic and optical components.
D(mm) | T(mm) | U(mm) | H(mm) | X(mm) |
4” /100 | 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 | 0.4, 0.5, 0.6, 0.8, 1.0, 1.3. | 20, 31.75 | 5, 10 |
5”/ 125 | 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 | 0.4, 0.5, 0.6, 0.8, 1.0, 1.3 | 20, 31.75 | 5, 10 |
6”/ 150 | 0.6, 0.8, 1.0, 1.2, 1.5, 1.8 | 0.5, 0.6, 0.8, 1.0, 1.3, 1.6 | 20, 31.75 | 5, 7, 10 |
8”/ 200 | 0.8, 1.0, 1.2, 1.5, 1.8 | 0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5. | 20, 31.75 | 5, 7, 10 |
12”/ 300 | 1.0, 1.2, 1.4, 1.5, 1.7, 1.8 | 0.7, 0.9, 1.1, 1.4 | 20, 31.75 | 5, 7, 10 |
16”/ 400 | 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 | 0.9, 1.2, 1.4, 1.6, 2.0 | 20, 31.75 | 5, 7, 10 |
20”/ 500 | 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 | 0.9, 1.2, 1.4, 1.6, 2.0 | 20, 31.75 | 5, 7, 10 |
Other size can be made according to customers’ requirement |
Detailed Specifications can be customized!
– Excellent cutting ability that help reduce chipping, fractures and achieve smooth surface finish
– Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc.
– Able to precisely control diamond concentration to achieve cutting quality
– Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to 250μm depending on blade thickness