2 Layer OSP Impedance Control Half Hole PCB
Product Quick Detail
- FOB Price
- USD $100.00 / Piece
- Place Of Origin
- china
- Minimum Order
- 1
- Packaging
- N/A
- Delivery
- 15 Days
Specifications
Number of layers: 2
Surface finish: OSP
Base material: FR4
Outer Layer W/S: 6/4mil
Thickness: 1.0mm
Min. hole diameter: 0.25mm
Special process: impedance control+half hole
Advantages Of 2 Layer OSP Impedance Control Half Hole PCB
Own lamination process to convenient production for Multilayer OSP PCB Finish and shorten the lead time.
Jiangxi facility is environmental-friendly approved by the government .
Famous raw materials brand, Kingboard, Shengyi, ITEQ, Taiyo, Guangxin.
Highly automated production line with AIO Optical Scanning, Electroplating Automatic Line, High-speed flying probe test machines and inkjet printer.
Engineers with more than 15 years of experience
Customers located in more than 20 countries, the common choice of 500 high-end companies.
Perfect quality inspection system
Professional R&D team can make all kinds of special boards.
Quick turn, prototype, medium or large batches can be produced to meet the needs of different customers.
Quick response to quotes.
As a pcb maker, we can offer sorts of pcb circuit for sale, more details, please contact us.
- Country: China (Mainland)
- Business Type: Manufacturer
- Market:
- Founded Year:2017
- Address:Building 2, Xinda Park, Lvyuan Road, Xinfeng County, Ganzhou 341600, Jiangxi
- Contact:Huihe Circuits
Other products from Xinfeng Huihe Circuits Co., Ltd.
Relate products of 2 Layer OSP Impedance Control Half Hole PCB
4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
4 Layer ENIG Impedance Control Half Hole Fr4 PCB
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...
