Wafer Back Grinding Wheel
Product Quick Detail
- Place Of Origin
- Zhengzhou City, Henan Province, China
- Minimum Order
- 1
- Packaging
- Paper Box
- Delivery
- 15-20 days
Specifications
E-Grind Back Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of
wafers with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our back-grinding
wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
Performance of Wafer Back Grinding Wheel
Leading technology
Good self-sharpening
No dressing required
High yeild rate of work-piece
Applications of Wafer Back Grinding Wheel
Used for wafer's back thinning in LED and Semiconductor industries.
Specifications of Wafer Grinding Wheel
Product Specification
Available shape 6A2T
Machine GALAXY, SPEEDFAM
Working Condition
Grinding Type Wet
There are many cbn grinding wheel suppliers in China, but we are one of the best choices for you.
If you want to know more kinds of crankshaft grinding wheels, please visit our website.
- Country: China (Mainland)
- Business Type:
- Market:
- Founded Year:
- Address:Room 1841, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou City, Henan Province, China
- Contact:egrindwheel com
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