The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and slitting of many materials, such as semiconductors, electronic components, ...
Henan E-Grind Abrasives Co., Ltd can offer the semiconductor industry cutting-edge dicing blades & grinding wheels of the utmost quality. Diamond tools play a significant part in the production of semiconductors from a wafer to a single chip. Dicing Blade & Grinding Wheels For ...