Dicing Blades Without Hub
Product Quick Detail
- Minimum Order
- 1
- Place Of Origin
- Henan Province, China
- Packaging
- Paper Box
- Delivery
- 15-20 days
Specifications
The wafer dicing blade without hub is a kind of ultra-thin and precision diamond dicing blades with excellent cutting ability, good rigidity, and high efficiency. It fits to be used for dicing and
slitting of many materials, such as semiconductors, electronic components, ceramics, etc.
Performance of Dicing Blades Without Hub
Strong cutting ability
High accuracy
The thinnest wheel is 0.015mm, thickness tolerance is ±0.002mm
Applications of ultra thin diamond blade Without Hub
For dicing BGA, Alumina, TiC, Ferrite, LTCC, and other materials.
E grind, as an excellent diamond wheel manufacturer, offers a wide range of resin bonded grinding wheels for you to choose from.
- Country: China (Mainland)
- Business Type:
- Market:
- Founded Year:
- Address:Room 1841, Tower A, Wanda Plaza, 171#, Zhongyuan Road, Zhengzhou City, Henan Province, China
- Contact:egrindwheel com
