SPUTTERING TARGET BONDING Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded ...
Category: sintered neodymium magnets/ sintered NdFeB magnets/rare earth magnets Advantages: high performance-price ratio; high magnetic energy, good machanical properties Disadvantages: poor temperature characteristic; poor corrosion resistance,surface treatment needed; price ...
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