1. Product Feature of Electronic Potting Silicone Rubber
HY 9055 silicone rubber
is a kind of low viscosity, Inherent flame resistance, two components addition cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the
feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic
components surface with materials of PC (Poly-carbonate), PP, ABS, PVC, etc. and metal materials.
2. Typical Application of Electronic Potting Silicone Rubber
HY 9055 electronic potting silicone rubber could be applied to
- high powered electronics,
- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
-It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.3. Technical Guidelines of of Electronic Potting Silicone Rubber
a, Pls put part A and part B in separate container and stir evenly before mixing the two part together.
b, Mixing Ratio: part A: part B = 1:1
c, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixture could be used for pouring.
HY-210can be applied to the sealing and pouring of various electronic components, and then forming insulation system with no corrosion and negligible shrinkage. HY-210is suitable for bonded seal of electronic components, power module and control module, LED invertor potting, ...
1.Product Feature of Electronic Potting Silicone Rubber HY-9055 silicone rubber is a kind of low viscosity, Inherent flame resistance, two components addition cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the ...
Technical Parameters forPCB Electronic Potting Silicone Properties index Part A Part B Before Curing Appearence Black fluid Colorless / yellowish fluid Viscosisty (cps) 2500±500 - Features when operation Mixing Ratio ( By weight) 10:1 Operating Time (25C /min) 20~30 Curing ...