Condensation encapsulating and potting compound
HY210 and HY215 are condensation silicone compound in two parts with the characteristics of low viscosity,easy pouring operation and good bonding feature.it can be cured completely at room temperature.the safety potting compound silicone can reach the EU ROHS requirement fully.
Application:
Applying for the surface of PC,PP,ABS,PVC,metal,etc
Potting for protection of general electronic module
Insulation,waterproof and bonding of electronics parts
Filling for LED,LCD electronic display,circuit board
Outdoor protection for LED screen
Technical Parameters for PCB Electronic Potting Silicone
Properties index | Part A | Part B | |
Before Curing | Appearence | Black fluid | Colorless / yellowish fluid |
Viscosisty (cps) | 2500±500 | - | |
Features when operation | Mixing Ratio ( By weight) | 10:1 | |
Operating Time (25 centigrade min) | 20~30 | ||
Curing time ( hr, basically cured) | 3 | ||
Curing time ( hr, perfectly cured) | 24 | ||
Hardness(shore A) | 15+/-3 | ||
After Curing |
Thermal Conductivity[W( m·K)] | 〉=0.4 | |
Dielectric Strength( kV/mm) | ≥25 | ||
Dielectric permittivity(1.2MHz) | 3.0~3.3 | ||
Volume resistivity(Ω·cm) | ≥1.0×1016 | ||
Fire Resistance | 94-V1 |
(Pls note all data of PCB Electronic Potting Silicone Rubber with black color above is in 25C with 55% humidity conditions. We don't guarantee a same date if testing under different conditions, or when data was regenerated).
Warm Tips for for PCB Electronic Potting Silicone
1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3. When it gets stratified after a period of storage, Please mix HY-210 evenly before using,
it does not affect the performance.
Package for for PCB Electronic Potting Silicone
1Kg ,5Kg ,20Kg ,25Kg ,200Kg.
Shelf Life and Transportation
1. Twelve(12) months when stored at 25 centigrade in original unopened packages.
2. This is a non-dangerous product, it can be transported as general chemicals.
3. Products exceed the storage life should be confirmed normal before using.
Technical Guidelines
1. Pls put part A and B in separate container and stir evenly before mixing the two
parts together.
2. Mixing Ratio part A:part B is 10:1
3. Bubble release if necessary, deaeration the mixture under 0.08 MPa for 3 minutes.
4. HY-215 is cured at roon temperature, so pls put it under room temperature after
pouring. It comes to next process when basically cured, and it takes about 24 hours
for completely cured.
If you need more information,pls contact Abbie:
Tel:86-755-89311348
Fax:86-755-89948030
Mob:86-18938867560
Mail:hyab at resinpu dot com
Facebook:HYJCY at SZRL dot net
YouTube:silicone0041 at gmail dot com
QQ:2355542681
Condensation encapsulating and potting compound HY210 and HY215 are condensation silicone compound in two parts with the characteristics of low viscosity,easy pouring operation and good bonding feature.it can be cured completely at room temperature.the safety potting compound ...
Condensation encapsulating and potting compound HY210 and HY215 are condensation silicone compound in two parts with the characteristics of low viscosity,easy pouring operation and good bonding feature.it can be cured completely at room temperature.the safety potting compound ...