Number of layer: 1-56L Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc. Copper weight: 0.5OZ-6OZ(18mil-210mil) Board thickness: 0.2-7.2mm(8mil-282mil) Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc. Silk screen: White, blue, ...
PCB Specifications: Base material: FR4 Layer: 6 layers with impedance control Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Solder mask & Silkscreen: Green & White Min. line space: 4 mil Min. line width: 4 mil ...
6L Printed Circuit Board Layer:6L Material: FR4 TG170 Thickness:1.6mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.25mm Surface Finish: ENIG Finish Copper:35/35μm ...