-High bond strength to surfaces
-Excellent wet-out and high thermal performance
Typical Application Includes:
-Where need mount heat sink onto BGA graphic/drive processor
-LED Lighting
Configurations:
-Sheet form/roll form/die-cut parts
Available Thickness:
-0.1, 0.15, 0.2, 0.25, 0.3mm -Max.width:1030mm
http://www.leaderopus.com