COG LCD Display Modules
Product Quick Detail
- Minimum Order
- 1
- Packaging
- N/A
- Delivery
- 15 Days
Specifications
Chip-On-Glass (COG) is a flip chip bonding method which
is used for connect assembly of bare integrated circuits
on glass substrate directly by using Anisotropic Conductive Film .
The pitch of the IC bumps can be scaled down according to customers'
requirements . This method reduces the assembly area to the highest
possible packing density, which especially important to those
applications that space saving is crucial. It allows a
cost-effective mounting of driver chips because integrating
flex PCB is no longer required. The IC is bonded directly onto
the glass substrate and is suitable for handling high-speed or high-frequency signals.
http://www.blazedisplay.com
- Country: China (Mainland)
- Business Type:
- Market:
- Founded Year:2009
- Address:5/F, HSAE Tech Building, Hi-Tech Park, Nanshan, Shenzhen, 518057, China
- Contact:info hu
