BGA169(eMMC) Reball Kit_14X18mm,NAND flash repair ,Reballing Kit
Product Quick Detail
- FOB Price
- USD $165.00 / Piece
- Minimum Order
- 1
- Place Of Origin
- China
- Packaging
- N/A
- Delivery
- 5-7 days
Specifications
Aluminum alloy structure, lightweight and durable structure
Precision IC guide, accurate positioning.
Steel Dimensions: (80 x 80) mm, apply to BGA169, size: 14X18mm
The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.
For more other BGA Reballing Kit, please contact our sales man.
- Country: China (Mainland)
- Business Type: Manufacturer
- Market:Europe,European Union
- Founded Year:2010
- Address:A Area,Floor6,Building 4,Hanhaida High-Tech Park,The Tenth Industry Estate,Gongming Tianliao,Guangming New District,Shenzhen,China.
- Contact:vicky yuan
