Tight particle size distribution Blocky and etched surface Stringent oversize control Surfaces cleaned to extremely low levels of elemental impurities and ionic content Specific feed crystal source and monitoring Majority of sizes are from or proprietary Mesh-to-Micron process The above characteristics make this line the perfect product for High Pressure/High Temperature, semiconductor and microelectronics applications. MDP(N) is also used in wheel fabrication and high precision lapping and polishing applications.
Premium line of nickel-iron catalyst metal bond crystal
Carving Type: | Etched |
Technique: | Polished |
Material: | Crystal |