damaged silicon Dice

function faild DRAM DICE

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  • Country:Singapore
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Electroformed hub dicing blade for silicon wafer,copper wafer miya@moresuperhard.com

Type: hub dicing blade Brief introduction:electroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Application: silicon wafer, copper wafer Details ...

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