Vertical Furnace for 300 -mm Wafers

A Summary of Process Performance

Specification

• High processing capacity Up to 100 wafers can be continuously processed in 2 batches.
• Newly developed heating elements The furnace has heaters for low-temperature/low-temperature processes.
• N2 load lock The capacity of the VF-5900's N2 load lock chamber has been redesigned to enhance throughput.
• Ease of use Control is simplified by use of the Model 1400 controller which incorporates industry data requirements. (HSMS and GEM compatible.)
• Maintenance The removable FOUP buffer allows easier maintenance.
• Footprint Only the main unit of the VF-5900 is set up in the clean room; the supporting systems can all be installed under the floor to significantly reduce the overall footprint.

Features

The VF-5900, designed to process 300-mm wafers, can accept a stack of 12 FOUPs (Front Opening Unified Pods) and can continuously process 2 batches, each of 100 wafers. All the FOUPs loaded into the I/O port are conveyed to the buffer shelves. After that, only the FOUPs that are required are conveyed to the internal door opener. The wafers are transported in a vacuum-less environment by a highly reliable twin-arm this word means Z-theta movement robot. Ladder-type boat designed to minimize slip is a standard feature. The VF-5900 furnace uses an LGO heating element, and has a forced-cooling system to increase throughput. As an optional feature, N2 load lock can be utilized to maximize the processing capacity.

Summary

The VF-5900 furnace is a continuation of the VF-5300 model and has been developed to welcome the new age of 300-mm silicon wafers. The VF-5900 has a batch-processing system for the mass-handling of 300-mm wafers.

Vertical Furnace for 300 -mm Wafers