LPKF MicroLine 6000 P -laser system

LPKF MicroLine 6000 PCutting of printed circuit boards with high performance and low costs The LPKF MicroLine 6000 P is a laser system for , and with high performance and low costs. With its depth-controlled cutting it is able to perform half-cut operations e.g. for decap applications of rigid-flex PCBs.

More application examples are: in HDI circuit boards (high density interconnect circuit boards), and , , , , as well as of bare and assembled printed circuit boards.

The LPKF MicroLine 6000 P is characterized by its high flexibility. Only changing the layout data is necessary to modify the production parameters. The LPKF MicroLine 6000 P delivers unique throughput integrating a powerful UV laser source and a high speed linear positioning system. The Constant Scan Technology eliminates non-productive time by cutting while moving the scanner.

Tooling costs for die-cutting can be eliminated. It can easily be integrated into the production line. Thanks to its advantages the investment in an LPKF MicroLine 6000 P pays for itself in a matter of months.