Laser Processing Equipment

The control system is based on PC and provides the following:

TV-channel enables receipt on SVGA monitor live videopicture of the object for orientation of the workpiece followed by inspection of the quality of processing.

The system is designed for silicon wafer scribing, through (via) cutting according to a preset contour and drilling  holes in substrates of silicon and other materials used in microelectronics. Thickness range of processed substrates is up to 2 mm.

The substrates are processed by automatic linear step motor positioning in horizontal plane along X,Y axis relative to the laser beam. Angular orientation of the substrate is done by rotation of the worktable in horizontal plane (angle j). Motion of the laser systems lens in the vertical direction (Z) keeps laser beam focus position. The linear step motor with feedback ensures high precision processing with linear travel speed up to 600 mm/s at speed irregularity up to 5% max. The use of linear step motor on air bearing excludes friction and guarantees its long service life.

A solid-state YAG  laser, model RL-30Q, with Q-switch is used in the system as a laser source. Service life of laser heat is at least 10000 hours. Service life of pump lamp is at least 400 hours.

Laser power supply and cooling unit contains the system for selection and stabilisation of cooling water temperature. This allows to maintain the average power of laser radiation at high stability level. Interlocks of minimal flow of the cooling water and of its max temperature allows to enhance  reliability and service life of the laser.

The Laser Treatment System is controlled by IBM PC. Working program is made both with the use of own graphics editor and AUTOCAD editor. The computer allows to automatically select an optimum travel algorithm and the laser Q-switch control depending on the thickness of the processed material, its shape and contour of laser processing.

Laser Treatment System is designed for silicon wafer scribing