Laser Subsurface Engraving Machine

Specifications:
Laser Medium:          Diode-pumped solid-state laser
Cooling:                    Air cooled
Laser Wavelength:     532nm
Pulse Repetition Rate:       2 kHz
Pulse Width:            7ns
Pulse Energy:          1.2mJ
Laser Beam Quality: TEMoo, M2<1.5
Resolution:               500 DPI
Engraving Field:        max :160mm*160mm*100mm
Engraving Speed:      12000 dots/min
Input Electricity:        220VAC/110VAC, 50Hz            
Power Consumption:   0.6KW
Dimension (L*W*H):   760mm*560mm*560mm
Weight                      65kg

The machine combines with German, Russian, Italian technology and it adopts servo-controlling system with high precision and efficiency under the computer control, which has the features of high production efficiency and stable processing performance.

ST-C1 3D/2D Laser Subsurface Engraving Machine is a type of laser processing equipment that combines laser technology, computer technology and integrates optics, machinery and electronics together.

Specifications:
Laser Medium: Diode-pumped solid-state laser
Cooling: Air cooled
Laser Wavelength: 532nm