Silicon Wafer Laser Cutting Machine
Product Details
Not easy
Easy
Optics alignment:
3
12
Maintenance interval, month:
800-1,000
20,000
Pumping source life, h:
DI Water
Air
Cooling medium:
0.5-50
0-100
Frequency, kHz:
0.05
0.02
Min kerf width, mm:
120
300
Scribing speed, mm/s:
Lamp pumped
Diode pumped
Laser:
YMS-50
YMS-10D
|
Model: TECHNICAL PARAMETERS: 5. Friendly man-machine interface and simple software operation. 4. Precise CNC worktable 3. Auto cooling system 2. High-speed scribing (up to 300 mm/s), very low-defective index 1. Excellent beam quality and system reliability FEATURES: Silicon Wafer Laser Cutting Machine is capable of cutting various silicon wafer, in industries of semiconductor and solar energy, etc. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system. |
Silicon Wafer Laser Cutting Machine is used for silicon wafer(max.1.5mm) cutting in semiconductor industry and solar PV industry
- Laser Type:YAG
- Application:Laser Scribing
- Model Number:YMS-50&YMS-10D
- Brand Name:YUEMAO LASER
- Place of Origin:Guangdong China (Mainland)
- Country:China (Mainland)
- telephone:86-756-8911216
| Package: | WOODEN CASE |
| Payment Terms: | L/C,T/T |
| Port: | ZHUHAI |
| Laser Type: | YAG |
| Application: | Laser Scribing |
| Model Number: | YMS-50&YMS-10D |
| Brand Name: | YUEMAO LASER |
| Place of Origin: | Guangdong China (Mainland) |
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