Laser Pattern Generator

The system is designed for operation in clean room : Class 100 ( 9m²) for machine unit; Class 10 000 (10 m² ) for control unit. Power requirements: 220 V, 50 Hz.

Compatibility

Other Features

Chrome, chrome + oxide, molybdenum, iron oxide. Pellicle-protected reticles can also be inspected. A pellicle frame up to 8 mm high from top or bottom surfaces is acceptable.

Reticle Plating Types

Working field size is 153 mm x 153 mm

Reticle Sizes:

In low magnification mode - 15.0 mm²/s (12 min over 100 mm x 100 mm field)

In medium magnification mode - 5.0 mm²/s (35 min over 100 mm x 100 mm field)

In high magnification mode - 2.5 mm²/s (1 hr 10 min over 100 mm x 100 mm field)

Throughput

Low magnification mode is set by changing the objective lens.

Inspection Modes

Minimum sizes of detectable defects are: 0.7 ?m x 0.7 ?m and 0.5 ?m x 1.0 ?m at 0.95 detection probability. When working with any detection threshold (0.5 mm, 1.0 mm, 2.0 mm ) the mode of program filtering can be switched on.

Detection Threshold

For photomask inspection die-to-database comparison method is used.
The die-to-database comparison method makes the EM-6029B system universal for automatic detection of photomask pattern defects of all types.

The system is designed for automatic detection of pattern defects on 10:1 and 5:1 projection lithography reticles used in IC, semiconductors manufacture.

Automatic Mask Inspection System is designed for automatic detection of mask pattern defects by die-to-database comparison