Surface Mount Equipment

The EM-4227 Integrated Circuit Packing System is intended for packing large integrated circuits into tape carrier with the following covering by coating film. The machine can process integrated circuits in SOIC, SOP type packages and from sticks. Blister tape width is 8 mm, but can be widened to 56 mm.

Feeding, picking-up and placement of components, movement of blister tape for a pitch, attachment of coating film, and reeling on are carried out automatically. Reels with blister tape and coating film and sticks are changed manually. Changeover time for different type of integrated circuits is 30 min.

The working cycle is as follows:
Sticks with integrated circuits are set in the shaking feeder. A reel with blister tape, reel with coating film and empty reel are mounted on the packing mechanism. Blister tape is unreeled, fitted in the bulge of sprockets for its pitch movement, and threaded in the empty reel.
When interrogating sensors about presence of all the mechanisms at their initial positions, the rotating device is rotated to the picking-up position. Pickup pneumatic actuator operates, and a tool is lowered on an integrated circuit, vacuum is on, the tool is lowered with the integrated circuit, and then the rotating device is rotated by an angle of 22.5

The System is intended for packing large integrated circuits into tape carrier with the following covering