Surface Mount Equipment

The EM-4217 Transistor Packing System is intended for packing transistors in SOT-23 type packages into tape carrier. Transistors are laid into 8 mm wide blister tape from a shaking feeder and covered by coating film.
Feeding, picking-up and placement of components, movement of blister tape for a pitch, attachment of coating film, and reeling on are carried out automatically. Reels with blister tape and coating film are mounted and taken away manually.

The machine performs autodiagnostics of the cycles of movement, feeding, picking-up and placement of components.

The working cycle is as follows:
Transistors are bulked into the cup of the shaking feeder. A reel with blister tape, reel with coating film and empty reel are mounted on the packing mechanism. Blister tape is unreeled, fitted in the bulge of sprockets for its pitch movement, and threaded in the empty reel.
When interrogating sensors about presence of all the mechanisms at their initial positions, the rotating device is rotated to the picking-up position. Pickup pneumatic actuator operates, and a tool is lowered on a transistor, vacuum is on, the tool is lowered with the transistor, and then the rotating device is rotated by an angle of 22.5

The EM-4217 Transistor Packing System is intended for packing transistors in SOT-23 type packages into tape carrier