Encapsulation Systems
Product Details
The machine consists of encapsulation unit, device attaching mechanism, furnace, compound layer thickness control mechanism, and control rack.
The machine is equipped with a heater for heating compound containers, dispensers, work stages, furnace stage having temperature regulators what allows to hold temperature within
The System is designed for automatic application of programmable compound dose for encapsulation of chip-modules on reel tape
- Model Number:EM-3037
