Wire Bonders

EM-4320 TZ can be further upgraded to form bump-type thick lead wires for flip-chip technology.

• the second exchangeable bonding head;
• working stage that provides for X-Y positioning;
• exchangeable bonding head, ultrasonic generator and bonding tool for thick wire;
• blowpipe for local heating of the bonding area by hot gas current;
• rotating stage which enables to effect wire bonding in perpendicular planes.

The customer can get the basic version of the system with one bonding head and/or additionally equipped with:

EM-4320 enables to: 

The alignment of the first bonding pad with the bonding tool as well as loop direction and, if needed, subalignment of the second contact pad is to be done manually by means of a manipulator-microscope-light pointer system. Loop bonding and loop forming, ball forming at the end of gold wire and wire cut-off from the loop are all automatic as per preset cycle.
Loop forming & bonding parameters are to be preset by means of a keyboard and can be viewed on a mini LCD display.
The ball-forming unit and the ultrasonic generator are equipped with inspection and regulation systems of preset parameters.

EM-4320 Universal Wire Bonder is intended for bonding wires of a wide range of devices of electronics and can be implemented in the following models:
EM-4320-01 system intended for gold wire ball-to-wedge thermosonic bonding.
EM-4320-02 system intended for aluminum and gold wire bonding by means of wedge-to-wedge ultrasonic/thermosonic bonding.
EM-4320-03 system intended for wire bonding of increased ? 80 to 500 mm cross-section aluminum wire by means of wedge-to-wedge ultrasonic bonding.
EM-4320-04 system intended for gold (copper, platinum, palladium etc.) wire contact bonding.

Universal Wire Bonder is designed for thermosonic bonding of gold wires