Laser Scribing Machine

Maintenance interval, month:             3

Pumping source life, h:               800-1,000

Cooling medium:                    DI Water

Frequency, kHz:                     0.5-50

Min kerf width, mm                   0.05

Scribing speed, mm/s;              120

Laser:                                     Lamp pumped

Model:                                   YMS-50

TECHNICAL PARAMETERS:

5.Friendly man-machine interface and simple software operation

4.Precise CNC worktable

3.Auto cooling system

2.High-speed scribing (up to 120 mm/s), very low-defective index,

1.Excellent beam quality and system reliability

FEATURES:

Laser Scribing Machine YMS-50 is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet (~0.5 mm thick maximum),etc., in industries of electronics, semiconductor and solar energy, etc.. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, US and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system.

Laser Scribing Machine YMS-50 is capable of scribing various silicon wafer, solar cell, ceramic wafer, thin metal sheet,