Plasma Cleaning process

The LFC150G is configured for batch plasma processing of strips placed in slotted magazines and of wafers. The plasma cleaning concept is based on chemical reactions of gas-phase species with the contaminated surface. This is accomplished by exposing the susbtrates to a DC plasma. The system is equipped with a high vacuum pumping station consisting of a purged toburmolecular pump, a rotary vane pump, a high vacuum pump, and a hydrogen generator. The system has and excellent trhroughput and is suited for a wide variety of applications. Multi-step processing allows to combine the advantages of both hydrogen and nitrogen plasma. Key Features: - batch processing (up to 8 standard magazines) - Up to 8' wafer cleaning. - Indpendent Ar, H2 and N2. - Multi step processing sutible for wide range of applications. -