AgCu alloy as sputtering target is available.
Purity: 4N min.
Weight ratio: Ag72wt%+Cu28wt%, etc.
Density: 10g/cm3
AgCu alloy as sputtering target is available.
Purity: 4N min.
Weight ratio: Ag72wt%+Cu28wt%, etc.
Density: 10g/cm3
Place of Origin: | China |
Chemical Composition: | Ag 72wt%+ Cu28wt% |
Material: | AgCu 4N min. |
Brand Name: | King Choice |
Place of Origin: | China (Mainland) |
SPUTTERING TARGET BONDING Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded ...
Fitted turtleneck sweater embellished with a \"Kenzo Target\" intarsia. Knitted from lightweight, soft pure wool, it is finished with a ribbed collar. The model is 177 cm tall and wears a size ...
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Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded to a metallic or ceramic ...