Sputtering Target,Metal Target
Product Details
If you in need of these targets,please contact me freely..
Largest Dimension: 300*150*(6~12)mm
Resistivity: <0.2ohm.cm
Process: CZ./Casting
Type: Poly Boron doped/Mono Crystalline
Density: 2.33g/cm3
Purity: >99.999%min
Silicon Target
We can supply several kings of target,
include: Si target.ITO target,Ti target and so on..
welcome to contact..
- Chemical Composition:si
- Dimensions:as request
- Shape:as request
- Application:sputtering
- Model Number:sincown-si
- Brand Name:sincown
- Place of Origin:Fujian, China
- Country:China (Mainland)
- telephone:86-592-2650820
| Delivery Time: | within 7days after order confirm.. |
| Package: | Each target with vacuum bag or as request.. |
| Supply Ability: | 10000 Kilogram per Week |
| Minimum Order Quantity: | 1 Piece/Pieces |
| Payment Terms: | L/C,T/T |
| Port: | xiamen |
| Chemical Composition: | si |
| Dimensions: | as request |
| Shape: | as request |
| Application: | sputtering |
| Model Number: | sincown-si |
| Brand Name: | sincown |
| Place of Origin: | Fujian, China |
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Relate products of Sputtering Target,Metal Target
SPUTTERING TARGET BONDING Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded ...
Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded to a metallic or ceramic ...
Metal sputtering targets are critical components of the sputtering process used in the manufacturing of thin films for semiconductor and other advanced applications. These targets are high-purity metals or alloys with specific chemical compositions, and they are subjected to ...
