Patent pending for ozone wafer and excimer light processor.
Tsukuba Grand Slam-MK is the new generation mask clean system which has has following special futures.
1, Non-chemical clean system (just ppm order ammonia if needed)
2, Apply high concentrated ozonated water,
3, Apply excimer light energy
4, Apply Mega sonic system
5, Edge clean by non brash method
6, Fully automated plate handling
7, Ninety nine (99) process recipe applicable
8, Single mask handling system
9, Typical clean time : 3 masks/hr
First chamber for resist strip=20min
Second chamber for edge resist strip=20min
Third chamber for final clean =15min
Non-chemical single wafer processor for wafer and mask.
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