June Chip 300 Die Bonding machine

Die Bonding

Univeral Applications for Digital, Matrix, Super Flux LED, SMD LED, Chip @LED,lamp etc.
Average Cycle Time: 300ms / cycle
UPH:12K
Wafer X/Y :6"*6"
Workholder X/Y :10"*6"
Die Placement Accuracy:+ - 0.5mil
Die Size:5mil-40mil
Wafer Diameter: 6"
Maximum 4 wafers working at the same time
Flexible and Changeable Collet Head
Automatic Inspection System, Automatic Level Detection
Intelligent PR System (iPR)
LCD touch screen
Bilingual Menu
Power 2000W
Dimension 1200 x 900x 1500mm
Weight 450kgs

Die Bonding the best wire bonding technology in China. Occuipeid 35% market share in China

  • Certification:ISO9001
  • Type:General
  • Automatic Grade:Automatic
  • Model Number:June Chip
  • Brand Name:JAL
  • Place of Origin:Finland
  • Country:China (Mainland)
  • telephone:86-755-86238792
Supply Ability: 50 Piece/Pieces per Month
Minimum Order Quantity: 1 Piece/Pieces
Port: shenzhen
Fob Price: US$28000-30000shenzhen
Certification: ISO9001
Type: General
Automatic Grade: Automatic
Model Number: June Chip
Brand Name: JAL
Place of Origin: Finland
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June Chip 300 Die Bonding machine

Certification:ISO9001 Type:General Automatic Grade:Automatic Model Number:June Chip Brand Name:JAL Place of Origin:Finland Die Bonding the best wire bonding technology in China. Occuipeid 35% market share in China ...

Come From Shenzhen June's Automation Co., Ltd.