wafer processor grand slam

Patent pending for ozone wafer and excimer light processor.
Tsukuba Grand Slam-MK is the new generation mask clean system which has  has following special futures.

       1, Non-chemical clean system (just ppm order ammonia if needed)
       2, Apply high concentrated  ozonated water,
       3, Apply excimer  light energy
       4, Apply Mega sonic system
       5, Edge clean by non brash method
       6, Fully automated plate handling
       7, Ninety nine (99) process recipe applicable
       8, Single mask handling system
       9, Typical clean time : 3 masks/hr
                   First chamber for resist strip=20min
                   Second chamber for edge resist strip=20min
                  Third chamber for final clean =15min

Non-chemical single wafer processor for wafer and mask.