Die Bonding
Univeral Applications for Digital, Matrix, Super Flux LED, SMD LED, Chip @LED,lamp etc.
Average Cycle Time: 300ms / cycle
UPH:12K
Wafer X/Y :6"*6"
Workholder X/Y :10"*6"
Die Placement Accuracy:+ - 0.5mil
Die Size:5mil-40mil
Wafer Diameter: 6"
Maximum 4 wafers working at the same time
Flexible and Changeable Collet Head
Automatic Inspection System, Automatic Level Detection
Intelligent PR System (iPR)
LCD touch screen
Bilingual Menu
Power 2000W
Dimension 1200 x 900x 1500mm
Weight 450kgs
Die Bonding the best wire bonding technology in China. Occuipeid 35% market share in China
Supply Ability: | 50 Piece/Pieces per Month |
Minimum Order Quantity: | 1 Piece/Pieces |
Port: | shenzhen |
FOB Price: | US $28,000 - 30,000 |
Certification: | ISO9001 |
Type: | General |
Automatic Grade: | Automatic |
Model Number: | June Chip |
Brand Name: | JAL |
Place of Origin: | Finland |
Certification:ISO9001 Type:General Automatic Grade:Automatic Model Number:June Chip Brand Name:JAL Place of Origin:Finland Die Bonding the best wire bonding technology in China. Occuipeid 35% market share in China ...
Come From Shenzhen June's Automation Co., Ltd.