COG Bonder Bonding Equipment
Product Details
The equipment is to bond Chip onto glass panel in TFT/LCD manufacturing by Auto aligning with keeping determined time, temperature and pressure condition.* Specification a. High Reliability and
accuracy. b. Auto Alignment/Self-Developed Image Processing System. c. Quick adjustment for different size of panel. d. CIM interface available.
High Reliability and accuracy
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Come From Golbal Link Co., Ltd.
