Compacta L30 - Through-hole plating line

• Processing sequence for the ABC panel plating (tenting) technique:
  • Cleaner
  • Conditioner
  • Pre-dip
  • Catalyst
  • Salt remover
  • Copper plate
    
    
• Equipment:
  • 5 treatment tanks, 2 of them with heaters
  • 1 galvanic copper bath
  • 1 triple-cascade rinse with flow control
  • 1 spray rinse tank with magnetic valve, foot switch and flow control
  • 1 free tank (i.e. for chemical tinning)
    
    
• Rectifier:
  • 1 Rectifier for copper plating 6 V / 40 A, seperate current and voltage display and setting. Residual ripple < 0.1 % DCU
    
    
• Bath control:
  • 2 PTFE/PFA coated heaters, controlled by analogue instruments, full digital timers with count-down, auto-reset and beeper. Air injection into the copper plating bath. Board movement by DC gear motor, adjustable speed.

Professsional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. This particular machine type is optimized in terms of space requirements annd costs. Compacta L 30 is suitable for the Dexter 3 D process (known on the market as the ABC chemical system). Bigger and customized units are also available (see our web site for COMPACTA L 400).

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