Screen Printer

The new system features a sealed head with a solder cartridge in it. This head prints the solder while moving over the stencil. The sealed head extends solder printing life compared with the squeegee method, and reduces solder waste radically. This head can also handle lead-free solder, which is degrated easily. The cartridge method also realizes quick change-over.

Full sealing cartridge head extends solder life and also improves work efficiency

The interactive change-over system eliminates operator performance deviations and errors.
The adoption of support pin gang chang-over optionalhas reduced conversion time
and has greatly improved operativity. By making the previously optional Universal Stencil
Holder into standard equipment, the machine is now capable of handling frames ranging
From D size to M. The printing condition library has also been expanded from 18 types to 32.

Better operativity and faster change-over "easier-to-use" now a reality

PC board transport time is shortened to 6 seconds by reassessing each action from PC board recognition.

Improvement of overall productivity

In addition to its proven high-speed printing capabilities, the SP28P-DH also incorporates a new stencil control system that is compatible with bump printing. This system achieves high-quality snap- off (free from stencil tension interference by controlling the movement of the table during snap-off. The new control system realizes super-fine-pitch bump printing.
Use of this system also requires a pick-up box and a vacuum pump.