Compact, High-Throughput Handles wafers of both 12 inches and 8 inches. More compact with an integrated cassette loader and unloader. Provides high-throughput with two processing lines. |
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High Quality and High Performance This is a sophisticated system developed by Lintec, the industry-leading supplier of UV curable dicing tapes. Supports the optimization of illuminance and light intensity with high output UV lamp and light intensity checking for each wafer process, and performs UV irradiation in an environment that prevents inhibition by oxygen*.
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Smooth and Safe Operation A large touch panel improves operability. Ensures safety for operations and maintenance, complying with the SEMI safety guidelines, from design to assembly stages. Supports CE marking |
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Factory Automation of Assembly Process Realizes factory automation of total assembly process by integrating host communication function and inline system. |
Host Communication (Communication format: Conforms to SECS I and HSMS/Software: Conforms to GEM) |
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Barcode System | |
Visual Inspection Support System | |
Double loader/unloader |
* Conducts UV irradiation in a chamber filled with nitrogen to expel oxygen which inhibits UV curing.
* Conducts UV irradiation in a chamber filled with nitrogen to expel oxygen which inhibits UV curing. |