die handler
Product Details
Available for 150 and 200mm wafers " Picks die as small as 6mil square " 700 to 1201 UPH throughput (Application dependent) " Quick change multi-needle eject heads " Programmable output stage for
waffle packs and GelPaks?(Alternative output formats ald?ce contact capability -7?dp???????Bp?
Available for 150 and 200mm wafers
