Table Top Slicing & Dicing Saw

Precision Diamond Slicing / Dicing Saw is designed for Laboratory and R & D use. This machine can be used for slicing, dicing or cutting all kinds of materials up 4" diameter wafer or rectangular material up to 8" length x 4" width x 1"in depth saw is fully controlled by a computer ( any computer of 486 or up to IBM compatible) with position accuracy of 0.01 mm or better. The sample stage with two-angle adjustment comes with the machine, which allows customers to cut materials at desired angle with +/- 0.5 Deg tolerance. Variable speed up to 3,000 RPM (with option of extending out to 10,000 RPM). Accepts all types of blades. Including Precision Diamond Slicing, Dicing, & Wafering Blades from 3" to 6" in diameter. Such as Sintered (metal bond), Resin Bond, & Electroplated (nickel bond) hubless blades 1A1R, 1A8, 1A1, and etc. Affordable precision and cost effective dicing and cutting saw for R&D Labs in Materials and Micro-electronics Research. Typical applications that have benefited from the use of this machine include: wafers and sheets of optical, optoelectronic, semiconductor ceramic or related materials that need to be sectioned into smaller squares or rectangles. If this slicing/dicing saw can meet your needs in dicing and cutting, why do you have to pay more for an expensive dicing saw? Made in U.S.A.